发明名称 THERMALLY CONDUCTIVE ENCAPSULANT MATERIAL FOR CAPACITOR ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a capacitor assembly that comprises a housing, a capacitor element that is hermetically sealed within the housing, and a thermally conductive material that at least partially encapsulates the capacitor element.SOLUTION: The capacitor element includes a sintered anode body, a dielectric overlying the anode body, and a solid electrolyte overlying the dielectric. The thermally conductive material has a thermal conductivity of about 1 W/(m K) or more as determined in accordance with ISO 22007-2:2014.SELECTED DRAWING: Figure 1
申请公布号 JP2016171312(A) 申请公布日期 2016.09.23
申请号 JP20160024596 申请日期 2016.02.12
申请人 AVX CORP 发明人 PETRZILEK JAN;NAVRATIL JIRI;BILER MARTIN
分类号 H01G9/06;C08K3/00;C08L83/04;C08L101/00;H01G9/028;H01G9/04;H01G9/08;H01G9/26 主分类号 H01G9/06
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