发明名称 Radio frequency grounding sheet for a phased array antenna
摘要 A method includes coupling a printed circuit board (PCB) and a first conductive sheet to a pressure plate to form an antenna sub-assembly. The first conductive sheet defines a first plurality of openings and includes a first plurality of bumps. At least one opening of the first plurality of openings is surrounded by a set of bumps of the first plurality of bumps. The method includes coupling the antenna sub-assembly to a cover to form an antenna assembly.
申请公布号 US9472843(B2) 申请公布日期 2016.10.18
申请号 US201313757451 申请日期 2013.02.01
申请人 The Boeing Company 发明人 Takeuchi Jimmy S.;Cameron Rodney D.;Heisen Peter T.
分类号 H01Q13/00;H01Q1/52;H01Q1/38;H01Q3/26;H01Q21/00;H01Q21/06;H01P11/00 主分类号 H01Q13/00
代理机构 Toler Law Group, PC 代理人 Toler Law Group, PC
主权项 1. An apparatus comprising: a cover including a plurality of waveguides; a pressure plate; a printed circuit board (PCB) comprising a plurality of radiating elements of a phased array antenna; a first conductive sheet defining a first plurality of openings and including a first plurality of bumps, wherein one or more openings of the first plurality of openings is surrounded by a set of bumps of the first plurality of bumps; and a second conductive sheet defining a second plurality of openings and including a second plurality of bumps, wherein one or more openings of the second plurality of openings is surrounded by a set of bumps of the second plurality of bumps, wherein the PCB is positioned between the first conductive sheet and the second conductive sheet, wherein the PCB, the first conductive sheet, and the second conductive sheet are positioned between the cover and the pressure plate, and wherein, the first plurality of bumps and the second plurality of bumps are constructed from a conductive material to function as ground contacts for the phased array antenna.
地址 Chicago IL US