发明名称 Deep trench capacitor manufactured by streamlined process
摘要 The present disclosure provides a deep trench capacitor device. A first capacitor electrode is made up of a doped region of semiconductor substrate in which two or more trenches are arranged. A second capacitor electrode is made up of a continuous body of conductive material. The continuous body of conductive material includes a lower body portion filling the two or more trenches and an upper body portion extending continuously over the lower body portion. The upper body portion extends upwardly out of the trenches by a non-zero distance. A capacitor dielectric liner is arranged in the two or more trenches to separate the first and second capacitor electrodes. The capacitor dielectric liner extends continuously out of the two or more trenches along outer sidewalls of the upper body portion.
申请公布号 US9472690(B2) 申请公布日期 2016.10.18
申请号 US201414318870 申请日期 2014.06.30
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Weng Wu-An;Chang Chen-Chien
分类号 H01L29/94;H01L29/66;H01L23/00 主分类号 H01L29/94
代理机构 Eschweiler & Associates, LLC 代理人 Eschweiler & Associates, LLC
主权项 1. An integrated circuit (IC) including a deep trench capacitor device, comprising: a first capacitor electrode comprising a doped region of semiconductor substrate in which two or more trenches are arranged; a second capacitor electrode comprising a continuous body of conductive material, wherein the continuous body of conductive material includes a lower body portion filling the two or more trenches and an upper body portion extending continuously over the lower body portion, wherein the upper body portion extends upwardly out of the trenches by a non-zero distance; a capacitor dielectric liner arranged in the two or more trenches to separate the first and second capacitor electrodes, wherein the capacitor dielectric liner extends continuously out of the two or more trenches along outer sidewalls of the upper body portion; wherein the capacitor dielectric liner comprises a first conformal oxide material lining respective trench sidewalls and covering respective trench lower surfaces of the respective two or more trenches, wherein the first conformal oxide extends out of the two or more trenches and extends over the semiconductor substrate without extending upwardly along the sidewalls of the continuous conductive body; a nitride material arranged in the two or more trenches and over the first conformal oxide material; and a second conformal oxide material arranged in the two or more trenches over the nitride material.
地址 Hsin-Chu TW
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