发明名称 |
Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer |
摘要 |
A wafer processing laminate, a wafer processing member, a temporary adhering material for processing wafer, and a method for manufacturing a thin wafer using the same. The wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed. The temporary adhesive material layer includes a first temporary adhesive layer of a thermoplastic organopolysiloxane polymer layer (A) releasably adhered on a surface of the wafer, a second temporary adhesive layer of a radiation curable polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer of a thermoplastic organopolysiloxane polymer layer (A′) laminated on the second temporary adhesive layer and releasably adhered to the support. |
申请公布号 |
US9472438(B2) |
申请公布日期 |
2016.10.18 |
申请号 |
US201314043327 |
申请日期 |
2013.10.01 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
Kondo Kazunori;Kato Hideto;Sugo Michihiro;Tagami Shohei;Yasuda Hiroyuki |
分类号 |
H01L21/683;H01L21/78 |
主分类号 |
H01L21/683 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. A wafer processing laminate comprising a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed,
wherein the temporary adhesive material layer comprises a three-layered structure complex temporary adhesive material layer comprising a first temporary adhesive layer of a thermoplastic organopolysiloxane polymer layer (A) releasably adhered on a surface of the wafer, a second temporary adhesive layer of a radiation curable polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer of a thermoplastic organopolysiloxane polymer layer (A′) laminated on the second temporary adhesive layer and releasably adhered to the support. |
地址 |
Tokyo JP |