UNIDADE DUPLA EM LINHA COM MOLDURA DE JANELA E PROCESSO PARA SUA FORMACAO

摘要

An integrated circuit package having a lead frame positioned between two lead glass layers on a ceramic base and a ceramic window frame bonded to the lead glass for accommodating a cap attached by a glass to gold to gold-tin eutectic bond. The various layers are applied by an advantageous combination of screen printing and fusing steps.