发明名称 System and method for predicting the temperature of a device
摘要 A method of predicting a temperature includes operatively coupling a temperature prediction circuit to a device including a semiconductor chip, determining a correlation between a current and voltage of the temperature prediction circuit, and predicting a temperature with respect to power applied to the device using the determined correlation.
申请公布号 US9482584(B2) 申请公布日期 2016.11.01
申请号 US201313776973 申请日期 2013.02.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Im Yun-hyeok;Park Kyol;Cho Tae-je
分类号 G01K7/00;G01K7/34;G01K7/16;G01K7/42 主分类号 G01K7/00
代理机构 F. Chau & Associates, LLC 代理人 F. Chau & Associates, LLC
主权项 1. A method of predicting a temperature, comprising: operatively coupling a temperature prediction circuit to a device comprising a semiconductor chip; determining a correlation between a current and a voltage of the temperature prediction circuit; predicting a temperature of the device with respect to power applied to the device using the determined correlation; and maintaining an operational temperature of the device such that the operational temperature does not exceed a critical temperature by adjusting the power applied to the device based on the predicted temperature, wherein the temperature prediction circuit comprises at least one resistor and at least one capacitor, and a plurality of nodes, wherein a resistance of the resistor and a capacitance of the capacitor each comprise a value such that the power applied to the device and current applied to the temperature prediction circuit have a substantially linear relation with each other, and a temperature of the device and a voltage measured at the temperature prediction circuit have a substantially linear relation with each other.
地址 Suwon-Si, Gyeonggi-Do KR