| 摘要 |
<p>An encapsulating process for electrical component is based upon drawing a sheet of heated thermoplastic foil over the item using suction through a base plate. The process permits components with inserted connector pins to be handled. The component (2) has a number of connector pins (3, 4) located in holes (5, 6) in a base plate (1). The hole depths are selected such that when the pins are fully inserted, a small gap (X) exists between the underside of the component and the base plate top surface. The heated foil sheet (8) is drawn over the component by applying suction through a number of holes in the base plate.</p> |
