发明名称 |
PROCEDE DESTINE A CONSTITUER DES REVETEMENTS SUR DES DISPOSITIFS SEMI-CONDUCTEURS DE CIRCUIT INTEGRE |
摘要 |
A coating system applies silicon dioxide to microelectronic dies mounted on electrical conductor systems such as lead frames, circuit boards and to connecting wires in a single operation while preventing the deposition of silicon dioxide on the outer portions of leads which are formed as part of its lead frame. |
申请公布号 |
FR2311404(A1) |
申请公布日期 |
1976.12.10 |
申请号 |
FR19760014041 |
申请日期 |
1976.05.11 |
申请人 |
NATIONAL CASH REGISTER CY |
发明人 |
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分类号 |
H05K3/28;C23C16/04;H01L21/00;H01L21/283;H01L21/316;H01L21/56;H01L21/60;H01L23/31;H01L23/50 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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