UNDERCOAT AGENT FOR SUBSTRATE WITH COPPER THIN FILM, SUBSTRATE WITH COPPER THIN FILM, CONDUCIVE FILM, AND ELECTRODE FILM

摘要

PROBLEM TO BE SOLVED: To provide a novel undercoat agent optimal for manufacturing a copper thin film substrate, especially a copper vapor-deposited plastic film and excellent not only in initial adhesion property with a substrate and a copper thin film, by also in adhesion property with the substrate and the copper thin film after treating the copper thin film substrate with an alkali solution.SOLUTION: There is provided an undercoat agent for a substrate with a copper vapor-deposited film containing an acrylic copolymer (A) having a primary amino group-containing group in a side chain. There is provided an undercoat agent for a substrate with a copper vapor-deposited film containing the acrylic copolymer (A) having a primary amino group-containing group in a side chain, one kind of curing agent selected from (meth)acrylate having at least three (meth)acryloyl groups, a melamine resin and a polyepoxy compound. There is provided an undercoat agent having amine value of the (A) component of 10 to 200 mgKOH/g and glass transition temperature of 0 to 150°C.SELECTED DRAWING: None