| 发明名称 |
SPATTERING METHOD |
| 摘要 |
PURPOSE:To carry out simultaneous spattering of plural substrates in a similar manner to the case of a substrate on the center of a substrate electrode or substrate support by setting up a cover on the substrate support. |
| 申请公布号 |
JPS52104477(A) |
申请公布日期 |
1977.09.01 |
| 申请号 |
JP19760021977 |
申请日期 |
1976.03.01 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
UMEZAKI MITSUMASA;SUGAWARA HIROSHI |
| 分类号 |
C23C14/50;C23C14/34;H01J37/34 |
主分类号 |
C23C14/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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