| 发明名称 |
Lead frame for a semiconductor device |
| 摘要 |
A lead frame for a semiconductor device, wherein a semiconductor chip-mounting portion, inner lead portions to be connected to the electrodes of said chip and outer lead portions connected to the inner lead portions are each formed of an iron core strip, both sides of which are clad with a layer of aluminum or alloy thereof.
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| 申请公布号 |
US4065625(A) |
申请公布日期 |
1977.12.27 |
| 申请号 |
US19750627258 |
申请日期 |
1975.10.30 |
| 申请人 |
TOKYO SHIBAURA ELECTRIC CO., LTD. |
发明人 |
IWAI, NAOJI;UCHIDA, TAKASHI;ABE, TAKEMI |
| 分类号 |
H01L23/50;B23K20/00;H01L21/48;H01L23/28;H01L23/495;(IPC1-7):B23P3/20;H01L23/48 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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