Low profile sensor package with cooling feature and method of making same

摘要

A sensor device and method of making same that includes a silicon substrate with opposing first and second surfaces, a sensor formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor, and a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface. The cooling channels instead can be formed on one or more separate substrates that are attached to the silicon substrate for cooling the silicon substrate.

主权项

1. A sensor device, comprising:
a silicon substrate with opposing first and second surfaces; a sensor formed at or in the first surface; a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor; a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface; a second substrate with opposing first and second surfaces, wherein the second surface of the silicon substrate is mounted to the first surface of the second substrate; a plurality of second contact pads disposed at the first surface of the second substrate; a plurality of electrical leads extending through the second substrate and electrically coupled to the plurality of second contact pads; and a plurality of wires each extending from one of the first contact pads to one of the second contact pads.