| 发明名称 | RF package with non-gaseous dielectric material | ||
| 摘要 | An RF package including: an RF circuit; a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit; and an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit. A package manufacturing method, including: identifying an RF circuit; dispensing a non-gaseous dielectric material upon the RF circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the RF circuit; and covering the RF circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the RF circuit. | ||
| 申请公布号 | US9461005(B2) | 申请公布日期 | 2016.10.04 |
| 申请号 | US201514620575 | 申请日期 | 2015.02.12 |
| 申请人 | Ampleon Netherlands B.V. | 发明人 | Weinschenk Christian;Mavinkurve Amar Ashok |
| 分类号 | H01L23/00;H01L23/31;H01L23/495;H01L21/02;H01L21/56 | 主分类号 | H01L23/00 |
| 代理机构 | McDonnell Boehnen Hulbert & Berghoff LLP | 代理人 | McDonnell Boehnen Hulbert & Berghoff LLP |
| 主权项 | 1. A package comprising: an RF circuit; a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit; and an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit. | ||
| 地址 | Nijmegen NL | ||