| 摘要 |
Method for encapsulating microelectronic elements, starting from strip-like material including a number of interconnected conductor patterns each having a number of leads for the microelectronic element to be encapsulated, which comprises applying a microelectronic element or crystal in the center of each conductor pattern, the terminal means of which are connected to the leads of the conductor pattern, after which the crystal-carrying strip-like material is so positioned in a mould that each crystal is substantially in the center of a mould cavity, which cavity is subsequently poured with an encapsulating synthetic material, wherein on each crystal-carrying conductor pattern on either side of the strip-like material a mould half provided with an aperture is placed in such a manner that the two apertures together form the mould cavity for the encapsulating material, the two mould halves serving as a permanent encapsulation for the crystal after pouring of the mould cavity. |
