发明名称 COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING IT, AND ROLLED MATERIAL FROM IT
摘要 One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic%, with a remainder being Cu and inevitable impurities, and a conductivity à (%IACS) is within the following range when the content of Mg is given as A atomic%, Another aspect of this copper alloy for an electronic device is composed of a ternary alloy of Cu, Mg, and Zn which includes Mg at a content of 3.3 to 6.9 atomic% and Zn at a content of 0.1 to 10 atomic%, with a remainder being Cu and inevitable impurities, and a conductivity à (%IACS) is within the following range when the content of Mg is given as A atomic% and the content of Zn is given as B atomic%,
申请公布号 EP3009523(A3) 申请公布日期 2016.11.02
申请号 EP20150193147 申请日期 2011.05.13
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 ITO, YUKI;MAKI, KAZUNARI
分类号 C22C9/04;C22C1/02;C22C1/03;C22F1/08;H01B1/02 主分类号 C22C9/04
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