| 摘要 |
PURPOSE:To perform sure bonding by thermo-compression-bonding elements to the rough surface of gold or gold alloy foils formed on the rough surface of Si element disposition base floor. CONSTITUTION:A rough surface is formed on an element disposition base 2C'. A gold or gold alloy foil 10 with the score (rough surface) having been provided on its one main surface being faced upward is placed on said surface to be put in face contact with an element 1. The base is then heated to 350 to 400 deg.C in a neutral or reducing atmosphere to form gold-Si eutectic, whereby connection is effected. This method increases the contact area of the foil and the lement owing to the score provided on the foil and expedites and stabilizes the eutectic formation through concentration of heat. As a result, sure bonding may be performed even if temperature is kept rather low. |
