Light emitting diode package with enhanced heat conduction

摘要

A light emitting diode (LED) device and packaging with enhance heat conduction. An LED in a wafer level processing (WLP) package is disclosed using vias in the silicon to route the electrical connections to the LED backside and a dedicated hole in the silicon with a direct heat conduction route from the LED to the printed circuit board. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids or ameliorates heat dissipation problems found in conventional LED devices. Some embodiments include a plurality of optically permissive layers, including an optically permissive cover substrate comprising phosphors and/or quantum dots.

主权项

1. A light emitting device, comprising:
a substrate having opposing first and second substrate surfaces; a semiconductor LED including doped and intrinsic regions thereof, said semiconductor LED having opposing first and second LED surfaces, said first LED surface disposed on the first substrate surface; a thermally conductive layer disposed on the second LED surface of the semiconductor LED; a carrier wafer disposed on the thermally conductive layer; at least one optically reflective surface disposed between said carrier wafer and said semiconductor LED; and a substantially optically transmissive layer disposed proximal to the second substrate surface, wherein the carrier wafer and the thermally conductive layer define a relief to expose at least a portion of the second LED surface.