| 发明名称 | Array substrate with connecting leads and manufacturing method thereof | ||
| 摘要 | An array substrate with connecting leads and a manufacturing method thereof are provided. The array substrate includes a substrate; a plurality of signal lines formed of a metal layer, which are disconnected at a cut zone of the substrate; a plurality of connecting leads disposed in an adjacent layer of the signal lines, which correspond to locations of the signal lines where they are disconnected, and directly contact with the signal lines; wherein, two ends of each of the signal lines in its disconnected position are electrically joined by the connecting leads, and the signal lines include gate lines, the connecting leads include first leads; wherein, the first leads are formed on the substrate, and the gate lines are located in an upper level than the first leads. | ||
| 申请公布号 | US9502441(B2) | 申请公布日期 | 2016.11.22 |
| 申请号 | US201414406950 | 申请日期 | 2014.05.27 |
| 申请人 | BOE Technology Group Co., Ltd.;Beijing BOE Display Technology Co., Ltd. | 发明人 | Hu Haichen;Xi Yusheng;Liu Jiarong |
| 分类号 | H01L29/04;H01L27/12;G02F1/1345;G02F1/1362 | 主分类号 | H01L29/04 |
| 代理机构 | Collard & Roe, P.C. | 代理人 | Collard & Roe, P.C. |
| 主权项 | 1. An array substrate, comprising: a substrate; a plurality of signal lines formed of a metal layer, which are disconnected at a cut zone of the substrate; a plurality of connecting leads disposed in an adjacent layer of the signal lines, which correspond to locations of the signal lines where they are disconnected, and directly contact with the signal lines; wherein, two ends of each of the signal lines in its disconnected position are electrically joined by the connecting leads, and the signal lines include gate lines, the connecting leads include first leads; wherein, the first leads are formed on the substrate, and the gate lines are located in an upper level than the first leads. | ||
| 地址 | Beijing CN | ||