| 主权项 |
1. A molding compound supported redistribution layer (RDL) structure for an integrated circuit (IC) package, the RDL structure comprising:
a molding compound having opposite topmost and bottommost surfaces, and extending continuously from the topmost surface to the bottommost surface; a plurality of metal pillars, each extending through the molding compound and having
a top end protruded above the topmost surface of the molding compound, anda bottom end protruded below the bottommost surface of the molding compound; a bottom RDL on bottom of the molding compound and having
a plurality of first bottom metal pads, anda plurality of first top metal pads; a plurality of solder balls, each over the top end of a corresponding metal pillar among the plurality of metal pillars; and a chip mounted on the plurality of first bottom metal pads, wherein each solder ball among the plurality of solder balls covers a top face of the top end of the corresponding metal pillar, and extends around and covers a peripheral side face of the top end of the corresponding metal pillar, a density of the plurality of first bottom metal pads is higher than a density of the plurality of first top metal pads, the bottom end of each metal pillar among the plurality of metal pillars is electrically coupled to a corresponding first top metal pad among the plurality of first top metal pads, and in a thickness direction of the RDL structure, the bottom RDL is arranged between the chip and the plurality of metal pillars. |
