发明名称 SUBSTRATE BREAKING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate breaking device which can effectively break a substrate by heating or cooling in a scribe line direction the substrate formed with a scribe line, and can effectively break the substrate by accurately controlling heating or cooling of the substrate.SOLUTION: A substrate breaking device comprises: a first heat transmitting element for heating or cooling a first region of a substrate formed with a scribe line; and a second heat transmitting element arranged so as to be adjacent to the first heat transmitting element in the scribe line direction for cooling or heating a second region of the substrate reversely to the first region.SELECTED DRAWING: Figure 1
申请公布号 JP2016198981(A) 申请公布日期 2016.12.01
申请号 JP20150081696 申请日期 2015.04.13
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 SEO YONG SIK
分类号 B28D5/00;B26F3/06;C03B33/033 主分类号 B28D5/00
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