发明名称 |
SUBSTRATE BREAKING DEVICE AND METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate breaking device which can effectively break a substrate by heating or cooling in a scribe line direction the substrate formed with a scribe line, and can effectively break the substrate by accurately controlling heating or cooling of the substrate.SOLUTION: A substrate breaking device comprises: a first heat transmitting element for heating or cooling a first region of a substrate formed with a scribe line; and a second heat transmitting element arranged so as to be adjacent to the first heat transmitting element in the scribe line direction for cooling or heating a second region of the substrate reversely to the first region.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016198981(A) |
申请公布日期 |
2016.12.01 |
申请号 |
JP20150081696 |
申请日期 |
2015.04.13 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
SEO YONG SIK |
分类号 |
B28D5/00;B26F3/06;C03B33/033 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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