| 摘要 |
PURPOSE:To improve the high frequency characteristics of a hybrid integrated circuit by providing a groove on a header to surround a film circuit substrate to prevent an adhesive from expanding outwardly and to approach the electrode of the external part as near the film circuit substrate as possible. CONSTITUTION:The back surface of a film circuit substrate 10 is adhered onto the center of a header 1, and a V-shaped groove 2 is provided in the vicinity of the outer periphery thereof to allow the adhesive 11 to stop at the edge of the groove 2. The substrate electrode of MOS capacity 20 is adhered onto the header 1 in the vicinity of the outside edge of the groove 2, and the other electrode of the capacity 20 is connected at 21 to the electrode of the circuit substrate 10. The grounding electrode on the surface of the circuit substrate is connected at 22 in the vicinity of the outside edge of the groove 2. According to this configuration, the length of the connecting wires 21, 22 can be shortest and constant. Accordingly, the inductance becomes minimum constant value with superior high frequency characteristics and less irregular hybrid IC.
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