| 摘要 |
A masking compound comprising a synthetic resin mixture, which can also be used as an adhesion promoter between a plastic substrate and a metal coating deposited thereon, and is likewise suitable as a diffusion and solder mask, as used for the production of printed circuits, because it is sufficiently heat resistant to withstand the temperatures occurring during the mass soldering process, and is used, in particular, for the production of printed circuits having a conductor track width and a conductor track separation of less than 0.25 mm. The masking compound is based on at least one thermocurable polymer which, on exposure to heat, is converted directly from a liquid or gelatinous state into a solid state without running. In addition, the masking compound obtainable in this way is not attacked by the chemicals present in copper electroplating baths.
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