| 摘要 |
PURPOSE:To minimize leakage light output by perforating cap of package, inserting an optical fiber into the hole in such a manner that its one end sticks out from the hole and the other end faces a photosemiconductor device in the hole and filling the hole with black sealing resin. CONSTITUTION:A photodiode chip 2 is securely attached onto a stem 3 through a gold-plated insulation board 1, and an electrode of the chip 2 is connected to an outside lead 5, which pierces the stem 3, using a wire 4. And a bonding pad on the insulation board 1 is also connected to the outside lead 7 using a wire 6. And then, a metal cap 8 having a cavity on the bottom surface and a through hole 9 in the center is combined with the stem 3 and a chip is built in, and an optical fiber 10 is inserted into the through hole 9 in such a manner that its one end 12 is exposed and the other end is faced to the chip 2. And then, while filling the gap of the through hole 9, the top section of the cap 8 is filled with black epoxy type resin 17 containing a substance capable of absorbing light wavelength, so that leakage of light from a resin end 18 can be reduced. |
