| 摘要 |
In order to improve the dissipation of heat from components mounted on a circuit card, either the bottom side of the card's electrically insulating base wafer or the base foil or in the case of double-sided pattern cards 2, 3, 4 or multilayer circuit cards, the underside of the bottommost conducting layer 4, is connected via an electrically insulating layer 6 to one side of a metal backing plate 5. At least one edge of the backing plate is arranged to make thermal contact with a card holder designed for mounting of the card, which is configured to provide effective heat dissipation. <IMAGE> |
