| 发明名称 | Electroconductive ink composition | ||
| 摘要 | An electroconductive ink composition comprising silver particles (A), a compound having a siloxane backbone with a functional group (B), and an organic solvent (C), the silver particles (A) having a protective layer containing an amino group-containing compound and having a mean particle size of 1 nm or more and 100 nm or less, the content of the compound (B) being 4% by weight to 8% by weight based on the total amount of the composition, can form a circuit pattern on a polymer film with low heat resistance, and the obtained circuit pattern has excellent adhesion to a substrate and high conductivity. | ||
| 申请公布号 | US9481804(B2) | 申请公布日期 | 2016.11.01 |
| 申请号 | US201314394766 | 申请日期 | 2013.04.15 |
| 申请人 | OSAKA SODA CO., LTD. | 发明人 | Kawamura Kensuke;Umakoshi Hideaki |
| 分类号 | C09D11/52;H05K1/09;C09D11/033;C09D11/037 | 主分类号 | C09D11/52 |
| 代理机构 | Marshall, Gerstein & Borun LLP | 代理人 | Marshall, Gerstein & Borun LLP |
| 主权项 | 1. An electroconductive ink composition comprising silver particles (A), a compound having a siloxane backbone with a functional group (B), and an organic solvent (C), the silver particles (A) having a protective layer containing an amino group-containing compound (a-1) having a boiling point of less than 100° C. and an amino group-containing compound (a-2) having a boiling point of 100° C. or more and having a mean particle size of 1 nm or more and 100 nm or less, the content of the compound (B) being 4% by weight to 8% by weight based on the total amount of the composition. | ||
| 地址 | Osaka JP | ||