发明名称 Induced thermal gradients
摘要 A temperature difference between a first thermal sensor and a second thermal sensor on a first die is determined. The temperature difference is transmitted from the first die to a circuit on a second die. A temperature from a thermal sensor on the second die is determined. The temperature difference and the temperature from the thermal sensor are utilized on the second die to modify operational characteristics of one or more circuits on the second die.
申请公布号 US9490003(B2) 申请公布日期 2016.11.08
申请号 US201113077661 申请日期 2011.03.31
申请人 Intel Corporation 发明人 Shoemaker Kenneth D.
分类号 G01N25/72;G01K7/00;G06F1/00;G11C7/00;G01K3/14;G11C11/406;G01K3/08;G06F1/20;G06F1/32;G11C7/04 主分类号 G01N25/72
代理机构 Blakely, Sokoloff, Taylor & Zafman LLP 代理人 Blakely, Sokoloff, Taylor & Zafman LLP
主权项 1. An apparatus comprising: a first die having a thermal sensor; a second die stacked with the first die, the second die having a first thermal sensor and a second thermal sensor, the second die in close physical proximity with the first die and the thermal sensor of the first die aligned with the first thermal sensor of the second die, the second thermal sensor of the second die located at a hot spot of the second die, wherein the thermal sensor of the first die does not align with the second thermal sensor of the second die; a control circuit coupled with the first thermal sensor on the second die and the second thermal sensor on the second die, the control circuit to determine a temperature difference between the first thermal sensor on the second die and the second thermal sensor on the second die; management logic coupled with the control circuit and the thermal sensor on the first die, the management logic to receive a first value, based on the temperature difference, the first value to indicate a temperature differential range of a plurality of pre-defined temperature differential ranges, and the management logic to further receive a temperature measurement from the thermal sensor on the first die and to determine, based on the first value, an adjustment to the temperature measurement from the thermal sensor on the first die, and to further manage self-refresh parameters of the first die based on the adjustment to the temperature measurement.
地址 Santa Clara CA US