APPLICAZIONE PER LAMINAZIONE DI SOTTILI FOGLI E PELLICOLE DI RAME SU SUBSTRATI, RELATIVI METODI E PRODOTTI.

摘要

A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.