METHOD FOR MANUFACTURING BOARD STRUCTURE, BOARD STRUCTURE, METHOD FOR BONDING ELECTRONIC COMPONENT TO BOARD STRUCTURE, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide adhesiveness sufficient for improving the reliability when transporting an electronic component from the mounted position to a sintered position.SOLUTION: In a method for bonding an electronic component 50 to a board structure 10, the board structure 10 is removed from a support member by using a nozzle 40, positioned on the electronic component 50, and the first surface 22 of a board 20 is arranged oppositely to the electronic component 50. The nozzle 40 acts on the second surface 23 of the board 20. The board structure 10 is set on the electronic component 50, and since only an initial sticking agent 30 is in contact with the electronic component 50, a gap is formed between a bonding material 25 and the component 50.SELECTED DRAWING: Figure 7