发明名称 HIGH TEMPERATURE SOLDER FOR COPPER TUBE JOINING
摘要 PURPOSE:To obtain solder for copper tube joining that does not cause lowering of mechanical strength of soldered part and generation of separation of joined parts and cracking by blending a small specified quantity of Ag, In and Sb with the main component of Sn. CONSTITUTION:An alloy consisting of 0.1-2.0wt% Ag, 0.05-1.00wt% In, 0.05- 0.5wt% Sb and 96.5-99.8wt% Sn is used in copper tube piping as a high temperature solder for copper tube joining. This solder alloy shows high thermal fatigue desistance when used for hot water circulation and refrigerating circulation. It does not cause deterioration or cracking in soldered parts under any circumstances.
申请公布号 JPS56165588(A) 申请公布日期 1981.12.19
申请号 JP19800069031 申请日期 1980.05.26
申请人 AOKI METAL 发明人 SAITOU TAKASHI;KANEKO SEIICHI;SAWAHATA HIROAKI
分类号 C22C13/00;B23K35/26 主分类号 C22C13/00
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