| 摘要 |
<p>PURPOSE:To obtain a small hybrid module having good heat radiation property, by mounting a heat sink on an insulator, mounting circuit elements of larger heat release value on said heat sink, and mounting circuit elements of smaller heat release value on the rest of said heat sink. CONSTITUTION:A gate turn-off thyristor (GTO)9 as a main heat dissipator is mounted in the center of a heat sink 16. A polyimide film 15a is arranged between the heat sink 16 and a copper substrate 14. As a snubbing resistor 12 dissipates much heat next to the CTO9, mounting it on the heat sink 16 prevents heat produced at the GTO9 from diffusing sufficiently as far as the periphery of the heat sink 16. Hence, said resistor 12 is bonded to the copper substrate 14 directly. As a result, the effect of the heat sink 16 can be performed sufficiently by mounting the resistor 12 of relatively large heat release value directly on the copper substrate 14.</p> |
