| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer electronic device and a manufacturing method therefor.SOLUTION: A method of manufacturing a multilayer electronic device is provided. By executing first three-dimensional (3D) printing, a first insulation layer and a first rewiring layer (RDL) are formed on a first substrate. By executing second 3D printing, a second substrate and a plurality of through substrate vias (TSV) are formed on the first insulation layer. The plurality of TSVs are connected electrically with a plurality of first RDLs. By executing third 3D printing, a second insulation layer, and a plurality of second RDLs are formed on the second substrate. The plurality of second RDLs are connected electrically with the plurality of TSVs. A plurality of electrical contacts of the third substrate are bonded to the plurality of second RDLs where the substrate is mounted on the second insulation layer. The invention further provides a multilayer electronic device formed by such a method.SELECTED DRAWING: Figure 5 |
