| 摘要 |
The printed circuit board is produced by pressing rigid and flexible individual layers (3,1). To remove the rigid outer layer (3) in that area (6) of the printed circuit board which is required to be flexible, grooves (4,5) are made on the inside of the rigid outer layer (3) before pressing and on its outside after the conductor pattern (8a) has been produced and the part (6a) of the rigid outer layer (3) between the grooves (4,5) is broken out. In this way, the flexible area (6) of the printed circuit board is reliably and expediently covered and uncontrollable positional errors in the covering are eliminated. <IMAGE> |
