发明名称 Method of electrolytically depositing metal on a pattern
摘要 In the method, the pattern (2) and the main electrode (3) are placed in an electrolyte. An additional electrode (4) is mounted at a distance from the pattern (2) in the same electrolyte between the pattern (2) and the main electrode (3), the distance being such as to prevent their mutual contact during the metal deposition cycle. An electrical supply source (5) is connected to each electrode (3, 4) and to the pattern (2) in turn in the sequence tau 1 + tau 2 + tau 3 = T. During the time period tau 1, the positive pole of the electrical supply source (5) is connected to the main electrode (3) and the negative pole to the pattern (2), and metal is deposited on the latter. During the time tau 2, the positive pole of the electric supply source (5) is connected to the pattern (2) and the negative pole of the supply source (5) to the additional electrode (4), and metal is selectively dissolved at the pattern (2) while metal is deposited at the additional electrode (4). During the time tau 3, the positive pole of the supply source (5) is connected to the additional electrode (4) and the negative pole of the supply source (5) to the main electrode (3). Under these circumstances, the metal deposited at the additional electrode (4) is dissolved completely and deposited at the main electrode (3). The additional electrode (4) is made of a material which can be passivated during the anodic polarisation. <IMAGE>
申请公布号 DE3116789(A1) 申请公布日期 1982.11.11
申请号 DE19813116789 申请日期 1981.04.28
申请人 EKSPERIMENTAL'NYJ NAUCNO-ISSLEDOVATEL'SKIJ INSTITUT METALLOREZUSCICH STANKOV 发明人 V. TSVETKOV,IGOR;L. LEVIT,MAXIM;I. MOROZ,IONA
分类号 C25D1/00;C25D5/18;(IPC1-7):C25D1/00 主分类号 C25D1/00
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