| 摘要 |
The sintered contact material according to the invention consists of two separate base metals silver and copper. The base metals are present separate from one another in the microstructure. The metal oxide(s) is (are) dispersed in the base metals. The type and the amount of the metal oxide(s) are identical or different in the base metal domains. The metal oxides are dispersed at least in one base metal with a grain size < 1 mu m with an accumulation between 0.1 and 0.5 mu m, and a grain size > 1 mu m with an accumulation between 1 and 5 mu m. The proportion of silver in the overall material is between 10 and 80% by weight, in particular between 20 and 50% by weight.
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