| 发明名称 |
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component. |
| 申请公布号 |
US2016284665(A1) |
申请公布日期 |
2016.09.29 |
| 申请号 |
US201514665800 |
申请日期 |
2015.03.23 |
| 申请人 |
Advanced Semiconductor Engineering, Inc. |
发明人 |
YANG Tau-Jing;HUANG Kuo-Feng;NIEN Wei Yu |
| 分类号 |
H01L25/065;H01L25/00;H01L23/31;H01L23/552;H01L23/538 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device package, comprising
a substrate having a top surface; a first electrical component disposed on the top surface of the substrate; a second electrical component disposed on the top surface of the substrate, the second electrical component having a top surface; a conductive frame defining a top portion and a rim substantially perpendicular to the top portion, the top portion having a top surface, the conductive frame disposed on the top surface of the substrate to cover the first electrical component, the conductive frame including at least one opening in the top portion of the conductive frame, the at least one opening exposing the second electrical component, and the top surface of the top portion of the conductive frame being substantially coplanar with the top surface of the second electrical component; and an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component. |
| 地址 |
KAOSIUNG TW |
