| 摘要 |
PURPOSE:To enable high packaging density of semiconductor elements, by a method wherein the semiconductor element such as IC is bonded on the substrate of a thermal head applied with insulation substance, and is covered with a silicone resin, etc. CONSTITUTION:A protection film 6 is attached on the surface or periphery of the heating unit 1 of a thermal head by spattering. Then a solder resist (epoxy) 8 is applied and sintered on the part to which the protection film 6 and the semiconductor element 2 of IC, etc. are to be bonded, and on the substrate area 3 of the thermal head except the terminal to be taken outside. The semiconductor 2 such as IC is bonded to the specified position on the substrate 3 and is covered with silicone resin 7, etc. A polyamide resin or the insulator for a thick film may be applied as an insulator applicable to a desired part. |
