| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation mechanism capable of ensuring the heat conductivity from a cover member to a heat dissipation member even when a satisfactory space is hardly obtained for disposing a heat dissipation member on the bottom of the cover member while preventing increase of manufacturing cost.SOLUTION: The heat radiation mechanism includes: a cover member 130 that covers an electronic component (heat generation component) 110 being thermally connected to the electronic component 110; and a heat dissipation member 140 which is thermally connected to the cover member 130. The cover member 130 is disposed with a first bottom (bottom) 132a which is in contact with the electronic component 110, which includes: a base part 132 which covers the electronic component 110; and a joint part 131 which is molded integrally with the base part 132 and positioned on a side face 132b of the base part 132 being engaged with the heat dissipation member 140.SELECTED DRAWING: Figure 1 |
