发明名称 Systems and methods for dissipating heat in an enclosure
摘要 An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.
申请公布号 US9471116(B2) 申请公布日期 2016.10.18
申请号 US201414547217 申请日期 2014.11.19
申请人 General Electric Company 发明人 de Bock Hendrik Pieter Jacobus;Gross, Jr. William Earl;Whalen Bryan Patrick;Meier Robert Paul
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
代理机构 Ziolkowski Patent Solutions Group, SC 代理人 Ziolkowski Patent Solutions Group, SC ;Testa Jean K.
主权项 1. An enclosure, comprising: an outer casing having one or more walls; and a synthetic jet assembly configured to dissipate heat from the one or more walls and comprising: a bracket operatively coupled to the one or more walls of the outer casing; andtwo or more synthetic jets operatively coupled to the bracket such that the two or more synthetic jets are spaced apart from a surface of one or more walls of the outer casing, wherein the two or more synthetic jets are arranged in a multi-dimensional synthetic jet array; wherein the two or more synthetic jets are positioned between an outer surface of a respective wall of the outer casing and the bracket; and wherein the outer casing further comprises an extended surface disposed on at least one of the one or more walls of the outer casing.
地址 Schenectady NY US