| 摘要 |
PURPOSE:To prevent breaking, cracking, etc. due to the mutual collision of products, and to automate the manufacturing process without generating defectives by coating at least end surface of a package with a buffer film such as a synthetic resin film. CONSTITUTION:Lead pins 2 are projected from the side surfaces of the hard package 1 made of ceramics. Both end surfaces of the package 2 are coated with the applied films 3 of synthetic resin as the buffer films. The applied film 3 of the synthetic resin is softer than the package 1, and relaxes impact force to the packages 1 when the packages 1 mutually collide when the semiconductor device is automatically carried or handled. The applied film 3 of synthetic resin is coated by applying a material manufactured by dissolving a resin material, such as epoxy, malamine, phenol, urethane, etc. into a proper solvent, such as benzene, toluene, xylene, hydrocarbon, etc. onto the end surfaces of the package 1 and discharging electricity or heating and curing the material at room temperature. |
