| 摘要 |
An extraction device (10) is adapted for removing a linear array of dual-in-line integrated circuit packages (12), referred to herein as DIPs, from a corresponding array of slotted receiving sockets (14), mounted on a test board (16), and for effecting the temporary magazine-storage of the extracted DIPs. The device comprises a composite elongated body member (21) formed with a forward wedge-shaped portion (23), of essentially T-shaped cross-section, an elongated rearward magazine-supporting portion (24) and a handle portion (27), the latter being located adjacent the rearwardmost end of the magazine-supporting portion (24), oriented downwardly and preferably being of pistol-grip configuration. The upper inclined surface of the forward wedge-shaped portion defines a DIP-extracting and guiding ramp (23b') of appreciable width, whereas the lower, longitudinally disposed edge of the forward portion is much narrower and is undercut on opposite sides to define a thin socket slot-receiving and device-guiding rib (23d). An elongated and relaceable DIP-storing magazine (28), preferably in the form of a U-shaped packing tube, is supported along the upper edge (24a ) of the rearward body member portion (24), and preferably also along a co-linear upper edge section (23f) of the forward wedge-shaped body member portion (23). The elongated packing tube (28) is removably confined on the composite elongated body member (21) by at least two longitudinally spaced and oppositely oriented C-shaped brackets (32, 33).
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