| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder and a bonding method that can accurately bond a die at a mounting position and has high reliability.SOLUTION: A head reference mark provided to a bonding head at a position which is located within an imaging field of view of an imaging camera and is offset from the collet center position of a collet sucking and holding a die is imaged by a mount imaging camera, a conveyance reference mark provided in a movement range of a bonding head of a conveyance path for conveying a substrate to a mounting position is imaged by the mount imaging camera, and a time-lapse posture deviation defined by a time-lapse positional deviation and a time-lapse rotational angle deviation caused by aging of the mount imaging camera and the bonding head with respect to the conveying path is detected on the basis of an imaging result of the conveyance reference mark and an imaging result of the head reference mark to determine the correlation position of the three members.SELECTED DRAWING: Figure 4 |
