| 摘要 |
An electrical assembly incorporates a multilayer printed circuit board comprising a flexible electrically insulating circuit board laminate (1) with electrical conductors (2) for connecting to terminals (3) on rigid slab-like heat-dissipating components such as circuit or component packages or carriers (4). A separate rigid metallic heat-sinking or spreading plate (16) is applied, having protruding thermally conducting pillars (17) passing through holes (15) in the circuit board laminate (1) to contact the components (4). A further rigid plate (8, 18, 28, 38) overlies the components (4) and is clamped by clips (9,11) or bolts (31) to plate (16). Compliant means (10, 20, 30, 40) such as springs of deformable and elastic rubber or plastics material is provided intermediate the further plate (8, 18, 28, 38) and the top of the components (4) to accommodate difference in height or thickness between the components (4) while transmitting pressure from the further plate (8, 18, 28, 38) to the top of the component (4) to ensure contact between the components (4) and the pillars (17) on the heat sinking or spreading plate (16). |
