发明名称 MULTI-SPINDLE COOLING DEVICE
摘要 PURPOSE:To cool a main spindle device effectively and evenly by a method wherein operating liquid is flowed through vapor pipes, liquid pipes and a communicating pipe, having flexible parts respectively, to transport the quantity of heat of bearings from the hollow chambers thereof to heat radiating devices. CONSTITUTION:The quantity of heat of the bearings 3, 31, which received the heat in bearing stands 4, 41, is deprived as the latent heat of evaporation when it heats the operating liquid, such as Flon or the like, in the hollow chambers 7, 71 and vaporizes it. The vapor of the vaporized Flon or the like moves to the heat radiating devices 8, 81 through the vapor pipes 10, 101 and is cooled by fans 9, 91. The condensed operating liquid returns into the hollow chambers 7, 71 of the bearing stands 4, 41 from the liquid pipes 12, 121 through the vapor pipes 10, 101. The liquid pipes 12, 121 are communicated mutually through a communicating pipe 13 having the flexible part.
申请公布号 JPS59118353(A) 申请公布日期 1984.07.09
申请号 JP19820231733 申请日期 1982.12.24
申请人 MITSUBISHI DENKI KK 发明人 INOUE HITOSHI;KATAOKA KENJI;YAMAKAGE HISAAKI
分类号 B23Q11/12;F16C37/00 主分类号 B23Q11/12
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