| 摘要 |
<p>PURPOSE:To improve mass production while miniaturizing the optical coupling element by arranging a light-emitting element and a light-receiving element on the same plane of the same substrate. CONSTITUTION:A light-emitting diode 10 in GaAs, etc. and a Si phototransistor 11, etc. are die-bonded and wire-bonded on the same surface of the substrate 9, and cases 1 with reflection planes 8 molded at 30 deg.-60 deg. so that beams radiated from the light-emitting diode 10 are reflected on the reflection plane 8, pass through windows 2 for transmitting beams and are reflected and are projected to the Si phototransistor 11, etc. are fixed to the substrate 9 by projections 7 for sealing. Accordingly, products can be mass-produced at low cost because the number of parts is few and processes up to a sealing on the substrate of the cases from the die-bonding and wire-bonding of the light-emitting diode and the Si phototransistor can be automated. The shape of products can be varied freely in a short time.</p> |
