| 摘要 |
The present invention relates to a process of preparing decorative coverings whereby a pattern is optionally provided on a backing and is then covered with a layer of thermoplastic material. Translucent or transparent chips having a thickness dimension not less than the thickness of the layer of material are applied to the surface thereof, the mateial is warmed, and the structure is consolidated to push the chips down into the layer of material until they contact the underlying surface. By doing so, the material residing between the chips and the underlying surface is extruded from beneath the chips, resulting in a plurality of windows onto the underlying surface. Structures produced according to the present invention exhibit unique visual properties and are useful as floor coverings, wall coverings, and the like. |
