| 摘要 |
<p>A radiation-sensitive composition comprises (1) a polymer containing repeating units of the formula:
<Chemistry id="chema01" num="0001"><Image id="ia01" he="4" wi="41" file="IMGA0001.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /></Chemistry>I (COOR<Sup>3</Sup>)<Sub>n</Sub> wherein R<Sup>1</Sup> is a trivalent or (COOR<Sup>3</Sup>)" tetravalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R<Sup>2</Sup> is a divalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R<Sup>3</Sup> is hydrogen or an ammonium ion, n is 1 or 2, and COOR<Sup>3</Sup> is located in an ortho or peri position with respect to the amide linkage, (2) an organic compound having a radiation-dimerizable or radiation-polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt, and (3) an aromatic secondary or tertiary amine compound which is chemically inactive with actinic radiation. This composition has an improved photosensitivity or radiation sensitivity and can give highly heat-resistant relief patterns with a good edge sharpness and good mechanical and chemical properties as well as good insulating properties. Heat-resistant relief patterns obtained from this composition are especially useful as insulating, passivating or protective coatings in semiconductor devices.</p> |
