发明名称 |
VACUUM VAPOR DEPOSITION PLATING APPARATUS PROVIDED WITH DEPOSITED AMOUNT DISTRIBUTION CONTROLLING MEANS |
摘要 |
PURPOSE:To control and uniformalize intentionally the distribution of the amt. of a vapor depositing material to be deposited on a substrate to be deposited by providing a variable impeding means of a vapor flow to a passage leading to an evaporating port of a vacuum vapor deposition apparatus, and changing and uniformalizing the vapor density. CONSTITUTION:An evaporation vessel 3 contg. a vapor depositing material 6 is arranged in a vacuum vessel 1 through which a belt-shaped substrate 2 to be vapor deposited passes. One or more opening and closing valves 8 such as a throttle valve (rotary plate valve) is provided into a passage 5 whereby the vapor of the vapor depositing material 6 reaches the surface of the substrate 2. The vapor density is changed and uniformalized by the opening degree of the valve 8. The distribution of the amt. of the vapor depositing material 6 deposited on the substrate 2 is intentionally controlled and uniformalized by said apparatus. |
申请公布号 |
JPS6021377(A) |
申请公布日期 |
1985.02.02 |
申请号 |
JP19830128884 |
申请日期 |
1983.07.15 |
申请人 |
NITSUSHIN SEIKOU KK;MITSUBISHI JUKOGYO KK |
发明人 |
ITOU TAKEHIKO;TSUKIJI NORIO;AIKOU TAKUYA;KITSUTAKA TOSHIHARU;FURUKAWA HEIZABUROU;KATOU MITSUO;WADA TETSUYOSHI |
分类号 |
C23C14/54;C23C14/04;C23C14/24;C23C14/56 |
主分类号 |
C23C14/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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