| 发明名称 |
CHIP DISCRETI PER SINOLI INCROCI FRA PISTE CONDUTTRICI DI CIRCUITI IBRIDI E PROCEDIMENTO PER LA LORO FABBRICAZIONE |
| 摘要 |
A form of construction of and a method for fabricating individual conductor paths in hybrid circuits having conductor crossovers are described. Integrated circuit chips forming the crossovers are metallized so that at least the peripheral areas crosswise to the crossed conductor paths are free from metal. |
| 申请公布号 |
IT1077067(B) |
申请公布日期 |
1985.04.27 |
| 申请号 |
IT19760028250 |
申请日期 |
1976.10.13 |
| 申请人 |
SIEMENS AG |
发明人 |
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| 分类号 |
H05K1/11;H01B13/00;H01L23/538;H05K3/22;(IPC1-7):H01L/ |
主分类号 |
H05K1/11 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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