| 摘要 |
An insulated-gate field-effect transistor which may be of the D-MOS or V-MOS type includes a source region (1) which is surrounded by a second region (2) of opposite conductivity type, itself surrounded by a third region (3) associated with the transistor drain (4). An insulated gate (12) of the transistor is present on a channel area of the second region (2) between the source region (1) and a first part (31) of the third region (3). The third region (3) also has a surface-adjoining second part (32) which is remote from the first part (31) and preferably has a lower doping concentration than the second and source regions (2, 1). An electrode layer (11) which may be the source electrode extends on said second part (32) of the third region (3) and is connected to said second region (2), and there is present between this electrode layer (11) and the second part (32) of the third region (3) a Schottky junction (33) having a lower forward voltage drop than the p-n junction (34) between the second and third regions (2,3). The transistor can have a fast switching speed even when driving inductive loads, since the Schottky junction (33) suppresses minority carrier injection at the forward-biased p-n junction (34) during voltage overswings. Preferably the second part (32) of the third region (3) is laterally bounded by the second region (2) which forms a guard ring for the Schottky junction (33) so maintaining a high blocking voltage capability. In order to further suppress minority carrier injection the electrode layer (11) preferably forms with the second region (2) a Schottky junction around which the source region (1) preferably extends as a guard ring.
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