发明名称 Film wiring for electrical engineering apparatuses, especially for electrical information technology
摘要 At the transition from film wiring (1) to soldering pins (4), especially of a plug (3) the problem of the film wiring (1) being bent and the leads breaking occurs in the event of bending stress. As protection, it is proposed to place an insulating film section (2) under the film wiring in the region of the soldering pins (4) and, preferably, to bend it back over the soldering pins towards the film lead and there to rivet it (6) to the other end of the film section, preferably outside the film lead. <IMAGE>
申请公布号 DE3405804(A1) 申请公布日期 1985.08.22
申请号 DE19843405804 申请日期 1984.02.17
申请人 SIEMENS AG 发明人 MAURER,HEINZ
分类号 H01R12/04;H01R13/56;H05K1/18;H05K3/34;(IPC1-7):H01R9/09 主分类号 H01R12/04
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